alt.hn

4/21/2026 at 2:50:40 PM

Advanced Packaging Limits Come into Focus

 https://semiengineering.com/advanced-packaging-limits-come-into-focus/

by PaulHoule

4/23/2026 at 10:32:50 PM

I had to read this for quite a while to be sure they weren’t actually talking about boxes

by pimlottc

4/23/2026 at 10:34:42 PM

It's just very small boxes.

by WJW

4/23/2026 at 9:24:21 PM

I'm really glad that last slide is in the article because I've been wondering this about Intel's push to become the king of thru-silicon vias, but didn't want to be the one sounding ignorant. When you etch holes in glass, fill the holes with metal, then solder it to something else, how does it not just shatter? The article just acknowledges the issues without suggesting where the solutions might come from.

by jeffbee

4/23/2026 at 11:20:51 PM

My intuition is that you get shattering when one part of the glass wants to warp across or away from another part that can't. Because of how thin the glass is in these processes, you mostly get warping and edge chipping, rather than something that can propogate catastropically

by cwillu